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broadcom - 1 - description the moonstone ? tri-color power led light source is a high- performance energy efficient device that can handle high thermal and high driving curren t. the exposed pad design enables excellent heat transfer from the package to the motherboard. the low-profile package design is suitable for a wide variety of applications especially wher e height is a constraint. the package is compatible with reflow soldering process. this provides more freedom and flexibility to the light source designer. applications ? contour lighting ? cove lighting ? architectural lighting ? garden lighting ? decorative lighting ? commercial lighting ? mood lighting features ? available in tri-color. ? energy efficient. ? exposed pad for excellent heat transfer. ? suitable for reflow soldering process. ? high current operation. ? long operation life. ? wide viewing angle. ? silicone encapsulation. ? non-esd sensitive (threshold > 16 kv). ? msl 5a products. specifications ? 3.5v (max) at 350 ma for ingan ? 2.3v (max) at 350 ma for alingap ? 120 viewing angle ASMT-MT00 moonstone? tri-color power led light source data sheet
broadcom - 2 - ASMT-MT00 data sheet figure 1 package drawing note 1. all dimensions in millimeters. 2. tolerance is 0.1 mm unless otherwise specified. 3. metal slug is connected to the anode of red. device selection guide (t j = 25c) part number color luminous flux, v (im) a, b a. luminous flux, v , is the total flux output as measured with an integrating sphere at 25-ms mono pulse condition. b. flux tolerance is 10%. test current (ma) dice technology min. typ. max. ASMT-MT00 red 33.0 40.0 56.0 350 alingap green 73.0 85.0 124.0 ingan blue 15.0 22.0 33.0 ingan metal slug ( heat sink) 10.00 8.50 0.64 5.25 10.50 1.27 3.30 r+ g+ b+ r+ gC rC bC 1.27 8.00
broadcom - 3 - ASMT-MT00 data sheet absolute maximum ratings optical characteristics at 350 ma (t j = 25c) electrical characteristics at 350 ma (t j = 25c) parameter allngap ingan unit dc forward current a a. derate linearly based on figure 8 for ingan and figure 9 for allngap. 350 350 ma peak pulsing current b b. pulse condition duty factor = 10%, frequency = 1 khz. 1000 1000 ma power dissipation 805 1225 mw led junction temperature 125 125 c operating metal slug temperature range at 350 ma C40 to +105 C40 to +105 c storage temperature range C40 to +120 C40 to +120 c soldering temperature see figure 11 . part number color peak wavelength, p (nm) dominant wavelength, d (nm) a a. the dominant wavelength, d , is derived from the cie chromaticity diag ram and represents the color of the lamp. viewing angle, 2 ? ( ) b b. ? is the off-axis angle where the luminous intensity is ? the peak intensity. luminous efficiency (lm/w) typ. typ. typ. typ. ASMT-MT00 red 635 625 120 54 green 519 525 120 76 bue 454 460 120 12 device type forward voltage, v f (v) at i f = 350 ma reverse voltage, v r (v) a a. not designed for reverse bias operation. thermal resistance, r j-ms ( c/w) b b. r j-ms is thermal resistance from led junction to metal slug. all 3 colors are lighted simultaneously during measurement. min. typ. max. typ. allngap 1.7 2.1 2.3 not recommended 23 ingan 2.8 3.2 3.5 20
broadcom - 4 - ASMT-MT00 data sheet figure 2 relative intensity vs. wavelength figure 3 relative luminous flux vs. mono pulse current 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity green blue red 0.4 0.6 0.8 1 1.2 allngap 0 0.2 ingan allngap 0 50 100 150 200 250 300 350 dc forward current - ma relative luminous flux (normalized at 350 ma) figure 4 forward current vs. forward voltage figure 5 radiation pattern 0 50 100 150 200 250 300 350 01234 forward voltage - v forward current - ma alingap ingan 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity figue 6 foa voltage sit . junction temeatue figue 7 relatie ligt outut . junction temeatue -0.40 -0.35 -0.30 -0.25 -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 25 50 75 100 125 150 blue red green junction temperature,t j - c forward voltage shift - v (normalized at 25c) 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 100.0 110.0 25 50 75 100 125 150 green red blue junction temperature,t relative light output - % (normalized at 25c) j - c
broadcom - 5 - ASMT-MT00 data sheet figure 8 maximum forward current vs. ambient temperature for ingan (derated based on t jmax = 125c, r j-a = 30c/w, 40c/w, and 50c/w) figure 9 maximum forward current vs. ambient temperature for alingap (derated based on t jmax = 125c, r j-a = 30c/w, 40c/w, and 50c/w) 0 50 100 150 200 250 300 350 400 0 20 40 60 80 100 120 140 ambient temperature, t a - c max allowable dc current - ma r t j-a = 30c/w r t j-a = 40c/w r t j-a = 50c/w 0 50 100 150 200 250 300 350 400 0 20 40 60 80 100 120 140 ambient temperature, t a - c max allowable dc current - ma r t j-a = 30c/w r t j-a = 40c/w r t j-a = 50c/w figure 10 maximum forward current vs. metal slug temperature (derated based on t jmax = 125c, r j-ms = 20c/w for ingan and r j-ms = 23c/w for alingap) 0 50 100 150 200 250 300 350 400 0 20 40 60 80 100 120 140 metal slug temperature, t ms - c max allowable dc current - ma r t j-ms = 20c/w r t j-ms = 23c/w
broadcom - 6 - ASMT-MT00 data sheet figure 11 recommended reflow soldering note for detail information on reflow soldering of broadcom surface mount leds, refer to broadcom application note an1060, surface mounting smt led indicator components . figure 12 recommended soldering land pattern 217c 200c 150c 60 - 120 sec. -6c/sec. max. 3c/sec. max. 3c/sec. max. 255 - 260c 100 sec. max. 10 - 30 sec. time temperature (acc. to j-std-020c) 10.00 5.00 7.35 7.50 3.90 3.50 0.64 1.00 1.27 pat numeing stem asmtCmt00C0 1 2 3 4 coe decition otion x 1 minimum flux bin 0 full distribution x 2 number of flux bins starting from x 1 0 full distribution x 3 color bin selection 0 red full distribution green bins a, b, c, or d blue bins a, b, c, or d x 4 packaging option 1 tape and reel
broadcom - 7 - ASMT-MT00 data sheet bin information flux bin selection (x 1 , x 2 ) individual reel contains the part from 1 bin only. color bin selection (x 3 ) individual reel contains the part from 1 bin only. packaging option (x 4 ) flux bin limit tolerance for each bin limits is 10%. color bin limit tolerance: 1 nm. example : ASMT-MT00-00001 x 1 minimum flux bin red green blue 0 full distribution ah l e x 2 number of flux bins starting from selected x 1 red green blue 0 full distribution a2 22 b2 23 d2 33 x 3 color bin combination red green blue 0 full distribution a, b, c, and d a, b, c, and d selection option 1 tape and reel bin id luminous flux (lm) at i f = 350 ma min. max. a5.57.0 b7.09.0 c 9.0 11.5 d11.515.0 e15.019.5 f19.525.5 g25.533.0 h33.043.0 j43.056.0 k56.073.0 l73.095.0 m 95.0 124.0 color bin id min. max. red full distribution 620.0 635.0 green a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 blue a 455.0 460.0 b 460.0 465.0 c 465.0 470.0 d 470.0 475.0 x 1 = 0 full distribution x 2 = 0 full distribution x 3 = 0 red (full distribution), green (a, b, c, and d), blue (a, b, c, and d) x 4 = 1 tape and reel option
broadcom - 8 - ASMT-MT00 data sheet figure 13 cie 1931 chromaticity diagram 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 y-coordinate x -coordinate red c d green blue b a c b d a
broadcom - 9 - ASMT-MT00 data sheet tape and reel option 1 figure 14 carrier tape dimensions note: all dimensions are in millimeters. figure 15 carrier tape leader and trailer dimensions dim value a 0 8.80 0.10 b 0 16.45 0.10 k 0 3.60 0.1 e 1.75 0.10 f 11.50 0.10 w 24.0 0.10 p 16.0 0.10 quantity/reel 250 units a a b ao b p section b section a ko w f e bo 2.5 end minimum of 160 mm of empty component pockets sealed with cover tape. mounted with components minimum of 390 mm of empty component pockets sealed with cover tape. start
broadcom - 10 - ASMT-MT00 data sheet figure 16 reel dimensions note: all dimensions are in millimeters. r10.00 60.0o ? 268.00 ? 330.00 1.00 ? 99.50 1.00 2.30 2.30 24.0 +1.00 ?0.00 ? 13.50 0.50 2.50 0.50 r10.50 0.50 120.0o
broadcom - 11 - ASMT-MT00 data sheet handling precautions the encapsulation material of the product is made of silicone for better reliability of the product. as silicone is a soft material, do not press on the silicone or poke a sharp object onto the silicone. this might damage the product and cause premature failure. during assembly or handling, the unit should be held on the body only. refer to broadcom application note an5288 for detailed information. moisture sensitivity this product is qualified as moisture sensitive level 5a per jedec j-std-020. precautions when handling this moisture sensitive product are important to ensure the reliability of the product. refer to broadcom application note an5305, handling of moisture sensitive surface mount devices for details. ? storage before use: unopened moisture barrier bag (mbb) can be stored at <40c/90% rh for 12 months. if the actual shelf life has exceeded 12 months and the humidity indicator card (hic) indicates that baking is not required, then it is safe to reflow the leds per the original msl rating. it is not recommended to open the (mbb) prior to assembly (e.g., for iqc). ? control after opening the mbb: the humidity indicator card (hic) shall be read immediately upon opening of mbb. the leds must be kept at <30c/60% rh at all times, and all high temperature re lated processes including soldering, curing, or rework need to be completed within 24 hours. ? control for unfinished reel: any unused leds need to be stored in sealed mbb with desiccant or desiccator at <5% rh. ? control of assembled boards: if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb needs to be stored in sealed mbb with desiccant or desiccator at <5% rh to ensure no leds have exceeded their floor life of 24 hours. ? baking is required if: hic 10% indicator is not blue and 5% indicator is pink. the leds are exposed to condition of >30c/60% rh at any time. the leds floor life exceeded 24 hours. recommended baking condition: 60 5c for 20 hrs.
for product information and a complete list of distributors, please go to our web site: www.broadcom.com . broadcom, the pulse logo, connecting everything, avago technologies, avago, and the a logo are among the trademarks of broadcom in the united states, certain other countries and/or the eu. copyright ? 2005-2017 broadcom. all rights reserved. the term "broadcom" refers to broadcom limited and/or its subsidiaries. for more information, please visit www.broadcom.com . broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. information furnished by broadcom is believed to be accurate and reliable. however, broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. av02-1693en C april 12, 2017

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